When the instantaneous power far exceeds the rated power of the device, the device chip will suffer electrical overstress (EOS) damage. Mild electrical overstress will cause leakage in the protective layer of the diode PN junction chip. Severe over-electrical stress will cause thermal breakdown failure of the chip.
More reading: Analyzing The Cause of LED Dead Light From LED Light Package Technology
I am thinking of replacing the TH with SMT. What are the differences between these two techniques?c
I am learning something about LED manufacturing, and I want to know how the factories glue a LED PCB board.
Some rows of the LED lights on my PCB are dimmer than they should be. But when the board is turned off and then back on, they will be fine. What are the reasons?
The process of high-power LED package is complex and the structure is cumbersome. LED package technology is influencing the performance and life of LED. In
Light LED package includes: bracket row packaging, chip packaging, module packaging, these packaging methods are common and commonly used by us. conventional existing packaging methods
SMD refers to Surface Mounted Devices, and SMD LED PCB is increasingly favored by LED manufacturers as surface mount technology (SMT) evolves. PCB is the
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