Qual é a melhor prática de PCB para colocação térmica via dispositivos semicondutores SMT?

How should I design the thermal via placement so that it can help dissipate the heat efficiently?

The heat vents should be as close as possible to the heat source under the heating element. If you will place the pad, you should also place the heat vents at the periphery of the component.

Small-diameter through holes with a diameter of about 0.3mm is suitable and can be filled by electroplating. And the spacing of the heat dissipation holes is about 1.2mm, arranged directly under the heat sink on the back of the package.

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